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Anleitung Zusammenfassung
. . . . . . . . . . . . . . . . IDE Memory. . . . . . . . . . . . . . . . . . 128,000 bytes (data buffer memory) * Battery performance features such as charge time, operating time, and life span can vary according to the conditions under which the computer and battery are used. Dell Latitude LM Service Manual Update Technical Specifications (continued) C D -R OM Dri ve (continued) Voltage . . . . . . . . . . . . . . . . . . 5 V (single-voltage drive) Access time. . . . . . . . . . . . . . . 250 m/sec Data transfer rate: Sequential . . . . . . . . . . . . . 150 KB/sec 900 KB/sec (6X) 1500 KB/sec (10X) From buffer. . . . . . . . . . . . 14.4 MB/sec Physical: Height . . . . . . . . . . . . . . . . 17.0 mm (0.67 inch) Width . . . . . . . . . . . . . . . . 130.6 mm (5.14 inches) Depth . . . . . . . . . . . . . . . . 140.6 mm (5.56 inches) Weight (no CD in tray) . . . 0.35 kg (0.77 lb) Additional Parts and Assemblies Removal and replacement procedures for all parts and assemblies are the same as those described in Chapter 4, “Removing and Replacing Parts.” However, some of the parts and assemblies used are different. The following information updates Table 4-1, “Factory Repair Parts and Assemblies,” in Chapter 4. Factory Repair Parts and Assemblies P a rt or A sse mb l y Number Orde r Numbe r Board As sembli e s Board assembly, 166-MHz, service kit SVC,SYS,PLN,LMP166ST Main board SYS,PLN,TFT,LMM Processor board, 166-MHz CRD,PRCR,LMP166 Card, cache CRD,L2,CACHE,LMP Heat sink, microprocessor, SUBASSY,HTSNK,CPU,LMM subassembly Screws, heat sink SCR,2X,4X4,PHH,MS,ZPS Spacer/Bumper, rubber, flex cable BMPR,LCD,FPC,25X5X5M,LMP Dell Latitude LM Service Manual Update Factory Repair Parts and Assemblies (continued) Part or Assembly Number Order Number Board Assemblies (continued) Foil, metal EMI SHLD,EMI,AL,W/CNDCT ADH,LMM Insulator, power supply INSUL,MYLAR,BD,CONV, DC-DC.LMP Board, power supply CRD,CONV,DC-DC,LMM Insulator, main board INSUL,MYLAR,BD,CONV, DC-DC,LMP Boards and Cards Cable, flex, audio jack CBL,FLEX,JK,AUD,W/EMI,LM CD-ROM CD-ROM, service kit* CUS,CD ROM,6X,LMP CD-ROM drive CD ROM,6X,LMP CD-ROM, service kit* CUS,CD ROM,I,INT,10X,LMP CD-ROM drive CD ROM,I,INT,10X,LM Hard-Disk Drive Assemblies Hard-disk drive, 2.1-GB, service kit* CUS,HD,2.1GB,I,F2,12.5MM Hard-disk drive, 2.1-GB, SUBASSY,HD,2.1G,F2, subassembly 12.5MM,NBK Hard-disk drive, 2.1-GB HD,2.1GB,I,F2,12.5MM,IBM Bracket, hard-disk drive BRKT,HD,12.5MM,LMP Screws, bracket SCR,M3,0x0,5,PHH,NPL LCD Assembly LCD, IBM, service kit SVC,LCD/FPC/INV,TFT,LMM,IBM Cable, TFT flex CBL,FLEX,LCD,TFT,IBM,W/ EMI,LM LCD, SA, service kit SVC,LCD/FPC/INV,TFT,LMM, SMSNG LCD panel, active-matrix color LCD,TFT,SVGA,12.1”,LM,SMSNG display (TFT), 12.1” * Customer-replaceable unit (CRU) Dell Latitude LM Service Manual Update Factory Repair Parts and Assemblies (continued) Part or Assembly Number Order Number LCD Assembly (continued) Board, TFT inverter CRD,INVRTR,TFT,SMSNG,LM Cable, TFT flex CBL,FLEX,LCD,TFT,SMSNG,LM Bezel, TFT back CVR,BK,LCD,TFT,SMSNG,LM LCD, LG, service kit SVC,LCD/FPC/INV,TFT,LMM,LG LCD panel, active-matrix color LCD,TFT,SVGA,12.1”,LMP,LG display (TFT), 12.1” Board, TFT inverter CRD,INVRTR,TFT,LMP,LG Cable, TFT flex CBL,FLEX,LCD,TFT,LG, W/EMI,LM Bezel, TFT back CVR,BK,LCD,TFT,LMP,LG Memory Memory module, 64-MB SODIMM, CUS,MEM,64M,LMP service kit* Memory module, two 32-MB DIMM,32MB,70NS,8X32,NBK,G Miscellaneous Parts Top cover, palmrest PLMRST,PLSTC,BLK,W/EMI,LM Top Case Assembly Guide rail, hard-disk drive, left RAIL,HD,LF,W/EMI PLD,LM Guide rail, hard-disk drive, right GDE, RL,RT,HD,LMP Case, base bottom CVR,BTM,PLSTC,BLK, W/EMI,LM * Customer-replaceable unit (CRU) Dell Latitude LM Service Manual Update Dell Latitude LM Service Manual Update 7 EMI Changes The following EMI changes may have been made to your computer, and the sections in Chapter 4 should be updated to reflect these changes. Keyboard The heat sink in your computer may be slightly different from the one shown in Figure 4-25. There may be a conductive sponge added to your computer. Top Assembly If you have a Latitude MMX computer, use the following figure for the removal and replacement procedure. The top assembly has two hard-disk drive contact springs on the underside of the top assembly. There is also a conductive sponge added to the top assembly (see the following figure). Top Assembly Removal hinge cover (2) keyboard touch pad connector main board top assembly bottom assembly (screws SD1 and SD2 are 5 mm) SD3 5 mm SD4 hook display close button SD1 SD2 (screws SD3 and SD4 are 3 mm) 3 mm kapton tape EMI foil heat sink conductive sponge When you separate the top assembly from the bottom assembly, peal the kapton tape from the EMI foil. Before replacing the top assembly, replace the old EMI foil with a new EMI foil and replace the old kapton tape with a new piece of kapton tape. Bottom Assembly The bottom assembly in your computer may have an I/O EMI shield and conductive sponges in additi...