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Anleitung Zusammenfassung
15 3. Block Diagram .................................................................................. 17 4. Memory Channel and SO-DIMM Configuration ...................................... 20 5. LAN Connector LED Locations ............................................................. 25 6. Thermal Solution and Fan Header ....................................................... 27 7. Location of the Standby Power LED ..................................................... 32 8. Front Panel Connector ....................................................................... 34 9. Back Panel Connectors ...................................................................... 35 10. Connectors and Headers (Bottom) ...................................................... 36 11. Location of the CIR Sensor ................................................................ 39 12. Location of the BIOS Security Jumper ................................................. 40 13. Board Dimensions ............................................................................. 42 14. Localized High Temperature Zones ..................................................... 44 Tables 1. Feature Summary ............................................................................. 11 2. Components Shown in Figure 1 .......................................................... 14 3. Components Shown in Figure 2 .......................................................... 16 4. Supported Memory Configurations ...................................................... 19 5. LAN Connector LED States ................................................................. 25 6. Effects of Pressing the Power Switch ................................................... 28 7. Power States and Targeted System Power ........................................... 29 8. Wake-up Devices and Events ............................................................. 30 9. Connectors and Headers Shown in Figure 10 ........................................ 37 10. PCI Express Half-Mini Card Connector ................................................. 38 11. BIOS Security Jumper Settings ........................................................... 41 12. Fan Header Current Capability ............................................................ 43 13. Thermal Considerations for Components .............................................. 45 14. Tcontrol Values for Components ......................................................... 45 15. Environmental Specifications .............................................................. 46 16. Acceptable Drives/Media Types for BIOS Recovery ................................ 50 17. Boot Device Menu Options ................................................................. 51 18. Master Key and User Hard Drive Password Functions ............................ 53 19. Supervisor and User Password Functions ............................................. 54 20. Front-panel Power LED Blink Codes ..................................................... 55 21. BIOS Error Messages ........................................................................ 55 22. Safety Standards .............................................................................. 57 23. EMC Regulations ............................................................................... 59 24. Regulatory Compliance Marks ............................................................ 63 1 Product Description 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the major features of the board. Table 1. Feature Summary Form Factor 4.0 inches by 4.0 inches (101.60 millimeters by 101.60 millimeters) Processor • Soldered-down Intel® Celeron® processor N2820 with up to 7.5 W TDP . Integrated graphics . Integrated memory controller . Integrated PCH Memory • Support for DDR3L 1066 MHz SO-DIMM • Support for 1 Gb, 2 Gb, and 4 Gb memory technology • Support for up to 8 GB of system memory with one SO-DIMM using 4 Gb memory technology • Support for non-ECC memory • Support for 1.35 V low voltage JEDEC memory Graphics • Integrated graphics support with Intel® Graphics Technology • One High Definition Multimedia Interface* (HDMI*) back panel connector Audio • Intel® High Definition Audio via the HDMI v1.4a interfaces • Intel HD Audio via a stereo microphone/headphone jack on the back panel • Back panel audio jack (3.5 mm jack) Peripheral Interfaces • USB ports: . Two USB 2.0 back panel connectors . One USB 3.0 front panel connector . One port is reserved for the PCI Express* Half-Mini Card • SATA ports: . One SATA 3.0 Gb/s port • Consumer Infrared (CIR) Expansion Capabilities • One PCI Express Half-Mini Card connector BIOS • Intel® BIOS resident in the Serial Peripheral Interface (SPI) Flash device • Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System Management BIOS (SMBIOS) continued Table 1. Feature Summary (continued) LAN Support Gigabit (10/100/1000 Mb/s) LAN subsystem using the R...