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Anleitung Zusammenfassung
Sequence Thermal and Mechanical Design Guidelines — Supporting the Intel® Celeron® processor 220. October 2007 318548-001 UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The Intel Celeron processor 200 sequence may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. This document contains information on products in the design phase of development. All products, platforms, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. All dates specified are target dates, are provided for planning purposes only and are subject to change. This document contains information on products in the design phase of development. Do not finalize a design with this information. Revised information will be published when the product is available. Verify with your local sales office that you have the latest datasheet before finalizing a design. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See for details. Shelton Conroe, Woodcrest and other code names featured are used internally within Intel to identify products that are in development and not yet publicly announced for release. Customers, licensees and other third parties are not authorized by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user. Intel, Celeron and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2007, Intel Corporation. All rights reserved. Thermal and Mechanical Design Guidelines s 1 Introduction.....................................................................................................7 1.1 Document Goals and Scope .....................................................................7 1.1.1 Importance of Thermal Management............................................7 1.1.2 Document Goals........................................................................7 1.1.3 Document Scope.......................................................................8 1.2 Reference Documents .............................................................................9 1.3 Definition of Terms.................................................................................9 2 Processor Thermal/Mechanical Information.........................................................11 2.1 Mechanical Requirements......................................................................11 2.1.1 Processor Package...................................................................11 2.1.2 Heatsink Attach ......................................................................16 2.2 Thermal Requirements..........................................................................18 2.2.1 Processor Junction Temperature................................................19 2.3 Heatsink Design Considerations..............................................................19 2.3.1 Heatsink Size..........................................................................20 2.3.2 Heatsink Mass ........................................................................21 2.3.3 Thermal Interface Material........................................................21 2.4 System Thermal Solution Considerations .................................................22 2.4.1 Chassis Thermal Design Capabilities...........................................22 2.4.2 Improving Chassis Thermal Performance ....................................22 2.4.3 Summary...............................................................................25 3 Thermal Metrology..........................................................................................27 3.1 Characterizing Cooling Performance Requirements....................................27 3.1.1 Example ...............................................